首页 > Begell House作者,编辑及审稿者
Gopal Madhu
School of Engineering, Cochin University of Science and Technology, Kochi-682022, India
Articles:
DYNAMIC THERMAL MODELING AND SIMULATION OF ELECTRONICS COOLING SYSTEM WITH LATENT HEAT STORAGE ENCAPSULATION - Vol. 0 '2017 - ICHMT DIGITAL LIBRARY ONLINE
EFFECT OF PHASE-CHANGING MATERIAL ENCAPSULATION ON FLOW BOILING IN A MICROCHANNEL-BASED ELECTRONICS COOLING SYSTEM - Vol. 30 '2018 - Multiphase Science and Technology
MODELING AND SIMULATION OF PHASE CHANGING MATERIAL ASSISTED FLOW BOILING IN RECTANGULAR MICROCHANNELS - Vol. 0 '2017 - Proceedings of the 24th National and 2nd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2017)