首页 > Begell House作者,编辑及审稿者
Wataru Nakayama
Tokyo Institute of Technology, 2-12-1 Oh-Okayama, Meguro-ku Tokyo 152, Japan
Articles:
FORCED CONVECTIVE/CONDUCTIVE CONJUGATE HEAT TRANSFER IN MICROELECTRONIC EQUIPMENT - Vol. 8 '1997 - Annual Review of Heat Transfer
Heat Transfer from Chips to Dielectric Coolant: Enhanced Pool Boiling Versus Jet-Impingement Cooling - Vol. 1 '1994 - Journal of Enhanced Heat Transfer
Enhanced Heat Transfer in Tight Space - A Frontier for Thermal Management of Microelectronic Equipment - Vol. 6 '1999 - Journal of Enhanced Heat Transfer
Thermal Performance of a Compact Two-phase Thermosyphon: Response to Evaporator Confinement and Transient Loads - Vol. 6 '1999 - Journal of Enhanced Heat Transfer
Forced Convective Boiling of a Flurocarbon Liquid in Reduced Size Channels – an Experimental Study - Vol. 9 '2002 - Journal of Enhanced Heat Transfer
PRESSURE DROP CHARACTERISTICS OF CIRCUIT BOARD WITH ARRAYS OF LSI PACKAGES - Vol. 0 '1993 - Transport Phenomena in Thermal Engineering. Volume 2
THE EFFECT OF MODULE/BOARD INTERFACE THERMAL RESISTANCE ON COOLING OF AN AIR-COOLED MODULE - Vol. 0 '1993 - Transport Phenomena in Thermal Engineering. Volume 2