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热管科学与技术

ISSN 打印: 2151-7975
ISSN 在线: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

热管科学与技术

DOI: 10.1615/HeatPipeScieTech.v1.i1.40
pages 59-70

DEVELOPMENT OF ADVANCED MINIATURE COPPER HEAT PIPES FOR A COOLING SYSTEM OF A MOBILE PC PLATFORM

L. L. Vasiliev, Jr
Luikov Heat & Mass Transfer Institute, National Academy of Sciences of Belarus, Porous Media Laboratory, P. Brovka Str. 15, 220072 Minsk, Belarus
Andrei G. Kulakov
Laboratory of Porous Media, A.V.Luikov Heat and Mass Transfer Institute, National Academy of Sciences, P.Brovka 15, 220072, Minsk, Belarus

ABSTRACT

At present, miniature heat pipes are widely used for cooling systems of mobile PCs. This paper presents an overview of the development of miniature heat pipes (MHP) with a sintered copper wick with emphasis to different ways of heat pipe wick optimization. Several designs of cylindrical heat pipes with 4-, 5-, and 6-mm outer diameter and 200-mm length, which are the most attractive for the CPU cooling system, have been tailored, tested, and compared to theoretical values in this study to evaluate its thermal performances. A new design of 4- and 5-mm-outer diameter miniature copper heat pipes with innovative wicks is suggested as a promising candidate for present and future cooling systems of high-power mobile PC platforms.