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强化传热期刊
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ISSN 打印: 1065-5131
ISSN 在线: 1026-5511

强化传热期刊

DOI: 10.1615/JEnhHeatTransf.2015006836
pages 481-489

EXPERIMENTAL INVESTIGATION OF THE WORKING PERFORMANCE OF A NOVEL MINIATURE LOOP HEAT PIPE

Xiao-Wu Wang
Department of Physics, School of Science, South China University of Technology, Guangzhou 510640, China
Zhenping Wan
Key Laboratory of Surface Functional Structure Manufacturing of Guangdong Higher Education Institutes, South China University of Technology, Guangzhou 510640, China
Yong Tang
Key Laboratory of Surface Functional Structure Manufacturing of Guangdong Higher Education Institutes, South China University of Technology, Guangzhou 510640, China

ABSTRACT

The loop heat pipe (LHP) is a promising means for electronics cooling because the LHP is an exceptionally efficient heat transfer device. In this paper, a novel miniature LHP (mLHP) system is presented. The arrayed pins are machined out on the bottom of a condenser to enhance condensation heat transfer, and copper planes with micro-caves and grooves are placed in the evaporator to propel fluid flowing and boiling. Tests are carried out on the mLHP with a CPU thermal simulator using forced air convection condenser cooling to validate the performance and the influence of the working material and its porosity. The experimental results show that the mLHP can reject a head load of 200 W while maintaining the cooled object's temperature to below 100° C, and for a variable power applied to the evaporator the system presents reliable start-ups and continuous operation. A larger porous wick can possess greater heat transfer capacity. A stable temperature rise and excellent heat transfer performance are obtained when water is used as the working material in the mLHP system.


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