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ON QUANTIFYING INTERFACIAL THERMAL RESISTANCE AND SURFACE ENERGY DURING MOLTEN MICRODROPLET SURFACE DEPOSITION
Department of Mechanical Engineering, State University of New York at Stony Brook, Stony Brook, New York, USA
Laboratory of Thermodynamics in Emerging Technologies, Institute of Energy Technology Mechanical and Process Engineering Department, ETH Zurich, Switzerland
Understanding and controlling the deposition of a molten microdroplet on a colder substrate with simultaneous heat transfer and solidification is of central importance to a host of technologies, exemplified by novel methods of electronic microchip manufacturing. The physics of the interfaciat phenomena involved are to date only partially understood. For instance, the transient resistance to heat transfer at the droplet—substrate interface cannot be quantified theoretically, and adequate experimental data are lacking. Serious obstacles to experimental determination are the very short time and length scales involved (of the order of micrometers: and microseconds). In the present article, a numerical modeling for droplet impact and solidification based on the Navier-Stokes and energy equations is used in order to reproduce transient measurements of the deposition of a eutectic Pb-Sn microdroplet on a multilayer wafer. The resistance to heal transfer at the droplet—wafer interface and the surface energy of the molten microdroplet are determined by matching numerical and experimental results. This successfully demonstrated indirect method is of interest if direct transient thermal resistance data are not available (as is very often the case).
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