RT Journal Article
ID 42286e6b20d855d3
A1 Menecier, S.
A1 Jarrige, J.
A1 Labbe, J. C.
A1 Lefort, Pierre
T1 RELEVANT PARAMETERS FOR LASER BONDING OF COPPER ON ALUMINA
JF High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
JO HTM
YR 2006
FD 2006-06-01
VO 10
IS 2
SP 281
OP 300
AB A laser process was used to produce copper tracks on alumina substrates. The numerous operating parameters involved made it difficult. In order to determinate the most influent factors among laser power (from 10 to 100 W), laser beam diameter (from 1 to 5 mm), preheating temperature of the substrate (from 200 to 400°C), scanning velocity (from 1 to 100 mrn·s−1), scanning overlap (from 0 to 90%) and copper grain size (three different powders), a Plackett and Burman's design of experiments has been used. With a very limited number of experiments (8), this method allowed to obtain first encouraging results. Indeed adherent copper tracks with an electrical conductivity of 6·104 S·m−1 were obtained.
PB Begell House
LK https://www.dl.begellhouse.com/journals/57d172397126f956,6bc97cde069281f6,42286e6b20d855d3.html