%0 Journal Article %A Wang, Xiao-Wu %A Wan, Zhenping %A Tang, Yong %D 2013 %I Begell House %K surface tension devices, electronics cooling, condenser design optimization, condensation heat transfer enhancement, passive enhancement %N 6 %P 481-489 %R 10.1615/JEnhHeatTransf.2015006836 %T EXPERIMENTAL INVESTIGATION OF THE WORKING PERFORMANCE OF A NOVEL MINIATURE LOOP HEAT PIPE %U https://www.dl.begellhouse.com/journals/4c8f5faa331b09ea,77b3d4ec1e88179c,68159ddc3107f811.html %V 20 %X The loop heat pipe (LHP) is a promising means for electronics cooling because the LHP is an exceptionally efficient heat transfer device. In this paper, a novel miniature LHP (mLHP) system is presented. The arrayed pins are machined out on the bottom of a condenser to enhance condensation heat transfer, and copper planes with micro-caves and grooves are placed in the evaporator to propel fluid flowing and boiling. Tests are carried out on the mLHP with a CPU thermal simulator using forced air convection condenser cooling to validate the performance and the influence of the working material and its porosity. The experimental results show that the mLHP can reject a head load of 200 W while maintaining the cooled object's temperature to below 100° C, and for a variable power applied to the evaporator the system presents reliable start-ups and continuous operation. A larger porous wick can possess greater heat transfer capacity. A stable temperature rise and excellent heat transfer performance are obtained when water is used as the working material in the mLHP system. %8 2015-03-18