%0 Journal Article %A Vasiliev, Jr, L. L. %A Kulakov, Andrei G. %D 2010 %I Begell House %K electronics cooling, miniature heat pipe, evaporation, porous media %N 1 %P 59-70 %R 10.1615/HeatPipeScieTech.v1.i1.40 %T DEVELOPMENT OF ADVANCED MINIATURE COPPER HEAT PIPES FOR A COOLING SYSTEM OF A MOBILE PC PLATFORM %U https://www.dl.begellhouse.com/journals/4b0844fc3a2ef17f,60441b0204b0f441,6a0d956609a3f41a.html %V 1 %X At present, miniature heat pipes are widely used for cooling systems of mobile PCs. This paper presents an overview of the development of miniature heat pipes (MHP) with a sintered copper wick with emphasis to different ways of heat pipe wick optimization. Several designs of cylindrical heat pipes with 4-, 5-, and 6-mm outer diameter and 200-mm length, which are the most attractive for the CPU cooling system, have been tailored, tested, and compared to theoretical values in this study to evaluate its thermal performances. A new design of 4- and 5-mm-outer diameter miniature copper heat pipes with innovative wicks is suggested as a promising candidate for present and future cooling systems of high-power mobile PC platforms. %8 2010-04-13