MICROSCALE HEAT PIPES
The present work reviews microscale heat pipes that utilize the latent heat of a working fluid to dissipate high heat fluxes using a passive system with a low mass. Microscale heat pipes, which have arrays etched on a silicon wafer, are used to dissipate high heat fluxes from microelectronic components. To overcome the force of gravity and for space applications, capillary-pumped loops and loop heat pipes, which are thermal control and heat transport devices developed in the Soviet Union and United State, respectively, are often employed. Pulsating heat pipes transfer thermal energy from the heat source to the heat sink using a pulsating exchange of sensible heat inside a capillary tube.
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Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS
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