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Heat Transfer Research
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ISSN Druckformat: 1064-2285
ISSN Online: 2162-6561

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Heat Transfer Research

DOI: 10.1615/HeatTransRes.v29.i1-3.120
pages 132-139

Characteristic Properties of the Mathematical Modeling of the Temperature Conditions of Printed Board Assemblies under Individual Gas Soldering of Electronic Components

Natalia Mikhailivna Fialko
Institute of Technical Thermophysics, National Academy of Sciences, Ukraine
V. G. Prokopov
Institute of Engineering Thermophysics, National Academy of Sciences of Ukraine, Kiev, Ukraine
V. G. Sarioglo
Institute of Engineering Thermophysics National Academy of Sciences of Ukraine Kiev, Ukraine

ABSTRAKT

A technique of mathematical modeling of the thermal state of printed board assemblies in gas soldering is proposed. The results of investigation of the tem-perature conditions of the assemblies are given for various location of placed electronic components on a printed circuit board.


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