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Heat Pipe Science and Technology, An International Journal

ISSN Druckformat: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.v5.i1-4.520
pages 457-463

NEW APPLOACH TO TWO-PHASE LOOP COOLING APPLICATION FOR HIGH DENSITY POWER COMPUTING HARDWARE

Jeehoon Choi
LG Electronics
Byungho Sung
Zalman Tech, 448 Gasan-dong, Gumchun-gu, Seoul, 153-803, Korea
Yunkeun Lee
Zalman Tech, 448 Gasan-dong, Gumchun-gu, Seoul, 153-803, Korea
Xung Hung Ngyuen
Sungkyunkwan University, 300 Chunchun-dong, Jangan-gu, Suwon, Kyunggi-do, 440-746, Korea
Chulju Kim
Sungkyunkwan University, 300 Chunchun-dong, Jangan-gu, Suwon, Kyunggi-do, 440-746, Korea

ABSTRAKT

High density power computing hardware is dependent mainly on forced convection created by fans since active cooling heat sinks combined with conventional heat pipes cannot attend high heat flux. More fans are added to computing hardware, leading to noise, vibration, and increased power consumption. To address this technological problem, loop heat pipe, capillary pumped loop, and other two-phase cooling applications have been receiving an increased attention from academic and industries but their several problems have not yet been solved to implement successfully commercial cooling applications. In this paper, a new evaporator departed from usual configurations was proposed to satisfy all aspects of technological problems. The two-phase loop cooling system with the new evaporator was experimentally investigated and compared its performance to commercially available active cooling heat sink. Experimental characterization shows that the loop cooling system can reach a maximum heat flux of 22.22W/cm2 with an overall thermal resistance of 0.13°C/W.