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Heat Pipe Science and Technology, An International Journal

ISSN Druckformat: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.2013007208
pages 83-96

HEAT TRANSPORT BEHAVIOR OF A MINIATURE LOOP HEAT PIPE USING WATER−NICKEL NANOFLUID

Roger R. Riehl
National Institute for Space Research INPE/DMC, São José dos Campos, SP Brazil, 12227-010

ABSTRAKT

The miniaturization of loop heat pipes (LHPs) has generated several other issues related to the thermal control of electronics and other devices with small surface areas designed for heat dissipation. When using miniature LHPs, one of the constraints is related to the limited contact area between the evaporator and the heat source. Another constraint is related to the working fluid used on the LHP, which depending on its application must represent fewer hazards to people and equipment, especially when home and office applications are involved. A recent line of research has demonstrated that nanofluids, which are regular working fluids with nanoparticles at some concentration, can be used on heat transfer equipment, resulting in better performance because the liquid thermal conductivity can be increased by 20% for a concentration of up to 5% by mass of the nanoparticles. Considering this recent line of research, this work has the objective of presenting the analysis of a miniature LHP operating with water and a related nanofluid. The obtained results showed that the LHP operating with nanofluid has lower heat transfer coefficients at the capillary evaporator when compared to its operation with pure water. Also, higher operation temperatures were observed when the LHP was charged with nanofluid as a result of higher pressure drops due to the presence of the solid nanoparticles, which could be verified from simulated results. The obtained results can be used to understand how a nanofluid can be applied in a system that operates by means of capillary pressure with the presence of a porous material that could be a limitation for such an application.


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