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Heat Pipe Science and Technology, An International Journal

Erscheint 4 Ausgaben pro Jahr

ISSN Druckformat: 2151-7975

ISSN Online: 2151-7991

AUTOMATED CHARGING OF EMBEDDED HEAT PIPE SYSTEMS

Volumen 3, Ausgabe 2-4, 2012, pp. 233-245
DOI: 10.1615/HeatPipeScieTech.2013006661
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ABSTRAKT

High-performance electronics cooling moves from utilizing modular heat pipes to fully integrated heat pipes. Filling and sealing of these nontubular embedded heat pipes is a challenge, since traditional methods such as evacuate, fill, and pinch do not suffice. This paper presents a charging station that is able to fill and seal embedded heat pipes in a reliable manner. A small, low-cost charge component is connected to the heat pipe. This allows the fill head of the charging station to mount the heat pipe in an automated manner. The charging station uses specially designed zero-dead-volume valves to minimize internal fluid volumes and thus increase the fill accuracy. Inside the fill head, the internal fluid line for filling and the plunger performing a pressed plug seal alternate position during the charging process. Prototype testing shows that the charging station is able to charge heat pipes in around 5 min with a final fill accuracy of 1.5 µL for a total fluid volume of 300 µL.

REFERENZEN
  1. Chi, S.W. , Heat Pipe Theory and Practice.

  2. Dunn, P.D. and Reay, D.A. , Heat Pipes.

  3. Faghri, A. , Heat Pipe Science and Technology.

  4. Hunkapiller, M.W. , Zero dead volume valve, Patent no. 4558845, 1985.

  5. OCZ Technology, CPU Cooler with Heat Pipe, Retrieved March 16, 2012, from http://www. ocztechnology.com, 2012.

  6. Peterson, G.P. , An Introduction to Heat Pipes: Modeling, Testing and Applications, Thermal Management of Microelectronic and Electronic Systems.

  7. Tom's Guide, Notebook Cooling with Heat Pipe, Retrieved March 16, 2012, from http://www. tomsguide.com, 2012.

  8. Wits, W.W., Legtenberg, R., Mannak, J.H., and Van Zalk, B. , Thermal management through inboard heat pipes manufactured using PCB multilayer technology.

  9. Wits, W.W., Kok, J.B.W., Legtenberg, R., Mannak, J.H., and Van Zalk, B. , Manufacturing and modelling of flat miniature heat pipes in multilayer printed circuit board technology.

  10. Wits, W.W. and Kok, J.B.W. , Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology.

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