RT Journal Article ID 3b48f1b135f1c285 A1 Prokopov, V. G. A1 Fialko, Natalia Mikhailivna A1 Sarioglo, V. G. T1 Characteristic Properties of the Mathematical Modeling of the Temperature Conditions of Printed Board Assemblies under Individual Gas Soldering of Electronic Components JF Heat Transfer Research JO HTR YR 1998 FD 1998-03-01 VO 29 IS 1-3 SP 132 OP 139 AB A technique of mathematical modeling of the thermal state of printed board assemblies in gas soldering is proposed. The results of investigation of the tem-perature conditions of the assemblies are given for various location of placed electronic components on a printed circuit board. PB Begell House LK https://www.dl.begellhouse.com/journals/46784ef93dddff27,2906653112975831,3b48f1b135f1c285.html