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DOI: 10.1615/ICHMT.2008.CHT.2390
page 17

John Reizes
School of Mechanical and Manufacturing Engineering, UNSW-Sydney, Sydney 2052, Australia


Since the heat generated by a microchip is directly proportional to the working frequency squared and to the circuit density, improvements in microchip performance require significant enhancements in thermal management. Micro-channels with synthetic jet cooling devices have been shown to be an effective approach in lowering the maximum chip temperature. In order to optimize the heat transfer between the silicon substrate and cooling fluid, a parametric study was performed to investigate the effect of operating frequency of the synthetic jet actuator at Rej=130. It is shown that, the change in the average heat transfer rate with frequency does not appear significant, yet the reduction of the maximum silicon temperature below its steady state value is 19.3K at 280 Hz and around 21.2K at two higher frequencies. This difference of 9% and is due to the redistribution of the local heat flux, in particular, to an increase with frequency in the local heat flux at the silicon/fluid interface opposite to the orifice.

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