Abo Bibliothek: Guest
Digitales Portal Digitale Bibliothek eBooks Zeitschriften Referenzen und Berichte Forschungssammlungen

THERMAL MANAGEMENT IN LED PACKAGING AND APPLICATIONS

DOI: 10.1615/AnnualRevHeatTransfer.2015011154
pages 371-414

Xiaobing Luo
State Key Laboratory of Coal Combustion and Thermal Packaging Laboratory, School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China

Run Hu
State Key Laboratory of Coal Combustion, School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China


SCHLÜSSELWÖRTER: Thermal Management, Light-Emitting Diode, Packaging, Thermal Resistance

Abstrakt

Although white light-emitting diodes (LEDs) have been widely used in our daily lives, they still suffer from overheating that limits the reliability and longevity of these devices. Hence, thermal management is indispensable in LED packaging and applications. The objective of this chapter is to describe LED thermal management techniques at three levels, i.e., chip level, module level, and system level. First, heat generation within the LED chip structure is calculated with the knowledge of solid-state physics or even quantum physics models. Then, the effects of LED packaging processes on the thermal behavior are analyzed. Moreover, the practicality of various kinds of thermal solutions for LED system is discussed. Recent advances in thermal management of high-power LEDs is also reviewed to provide comprehensive discussions for interested readers.

ARHT Digital Library