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Annual Review of Heat Transfer
Vish Prasad (open in a new tab) Department of Mechanical Engineering, University of North Texas, Denton, Texas 76207, USA
Yogesh Jaluria (open in a new tab) Department of Mechanical and Aerospace Engineering, Rutgers-New Brunswick, The State University of New Jersey, Piscataway, NJ 08854, USA
Zhuomin M. Zhang (open in a new tab) George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA

ISSN Print: 1049-0787

ISSN Online: 2375-0294

SJR: 0.363 SNIP: 0.21 CiteScore™:: 1.8

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Clarivate CBCI (Books) Scopus Google Scholar CNKI Portico Copyright Clearance Center iThenticate Scientific Literature

TRANSPORT PHENOMENA IN PRINTABLE ELECTRONICS

pages 149-192
DOI: 10.1615/AnnualRevHeatTransfer.2017016925
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ABSTRAKT

This review describes the transport processes in evaporation-driven self-assembly of colloidal drops containing functional materials for printable electronics fabrication. The jetting of solution-processed functional materials involves drop formation, impact, wetting, carrier liquid evaporation, and particle self-assembly and deposition, in which the interplay determines the final mechanical, thermal, and electrical properties of the deposited electronic materials. The capillary-driven, non-uniform deposition of functional materials challenges the quality of printable electronics that often require uniform patterns to achieve high performance. Several approaches have been introduced to suppress the coffee-ring effect. Numerical modeling to directly simulate particle–particle, particle–liquid, and particle–substrate interactions, and to predict final morphology of deposition patterns is discussed to better understand and control inkjet printing of colloidal drops for printable electronics fabrication.

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