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PHOTOACOUSTIC TECHNIQUE FOR THERMAL CONDUCTIVITY AND THERMAL INTERFACE MEASUREMENTS

DOI: 10.1615/AnnualRevHeatTransfer.v16.50
pages 135-157

Xinwei Wang
Iowa State University

Baratunde A. Cola
George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA

Thomas L. Bougher
George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA

Stephen L. Hodson
School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA

Timothy S. Fisher
Department of Mechanical Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47906; Department of Mechanical & Aerospace Engineering, UCLA, Los Angeles, CA USA

Xianfan Xu
School of Mechanical Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA

Abstrakt

The photoacoustic (PA) technique is one of many techniques for characterizing thermal conductivity of materials, including thermal interface conductance or resistance. Compared with other techniques, the PA method is relatively simple, yet is able to provide accurate thermal conductivity data over a wide range of materials and properties. In the last decade, the PA method has been developed and employed for measuring thermal properties of many materials. In this chapter, we will discuss the theory of the PA method for thermal conductivity/thermal interface resistance measurement. We will also describe experimental implementation of the PA method. Finally, we will discuss a recent application of using the PA method for characterizing thermal interface resistance of carbon nanotube–based thermal interface materials.

ARHT Digital Library

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Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
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