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Heat Pipe Science and Technology, An International Journal

ISSN Print: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.v5.i1-4.680
pages 589-596

AIR TO AIR THERMOSYPHON HEAT EXCHANGER FOR CABINET COOLING

Mathieu Habert
ABB Ltd. Switzerland, Corporate Research, Segelhofstrasse 1K, 5405 Daettwil, Switzerland
Bruno Agostini
ABB Ltd. Switzerland, Corporate Research, Segelhofstrasse 1K, 5405 Daettwil, Switzerland

ABSTRACT

Power electronics devices need active cooling to transfer heat from the enclosure to the ambient and maintain high ingress protection of the enclosure in order to protect the electronics from moisture and various dirt that would reduce its reliability. Air to air heat exchangers are widely used in the industry as they are cost-competitive, easy to install and maintain. On the other hand, they are inefficient and bulky. ABB holds a patent on a cost-effective modular compact thermosyphon based air to air heat exchanger for power electronics cabinet. This technology uses numerous multiport extruded tubes with capillary sized channels disposed in parallel to achieve the desired compactness. The experimental performance of this novel power electronics cooling system with R134a are presented in this paper for a single thermosyphon module. The influence of different parameters such as the heat load, fluid filling ratio, air temperature differences and flow rates were investigated. A numerical model was developed in order to predict the performance of the thermosyphon unit for various and changing operating conditions. Prediction shows good agreement with the experimental results.