Suscripción a Biblioteca: Guest
Portal Digitalde Biblioteca Digital eLibros Revistas Referencias y Libros de Ponencias Colecciones
Heat Transfer Research
Factor de Impacto: 0.404 Factor de Impacto de 5 años: 0.8 SJR: 0.264 SNIP: 0.504 CiteScore™: 0.88

ISSN Imprimir: 1064-2285
ISSN En Línea: 2162-6561

Volumes:
Volumen 50, 2019 Volumen 49, 2018 Volumen 48, 2017 Volumen 47, 2016 Volumen 46, 2015 Volumen 45, 2014 Volumen 44, 2013 Volumen 43, 2012 Volumen 42, 2011 Volumen 41, 2010 Volumen 40, 2009 Volumen 39, 2008 Volumen 38, 2007 Volumen 37, 2006 Volumen 36, 2005 Volumen 35, 2004 Volumen 34, 2003 Volumen 33, 2002 Volumen 32, 2001 Volumen 31, 2000 Volumen 30, 1999 Volumen 29, 1998 Volumen 28, 1997

Heat Transfer Research

DOI: 10.1615/HeatTransRes.2016015276
pages 827-848

NUMERICAL SIMULATION OF A BELLOWS-TYPE RECIPROCATING MECHANISM-DRIVEN HEAT LOOP (RMDHL)

Olubunmi T. Popoola
Department of Mechanical and Materials Engineering, Florida International University, Miami, Florida 33174, USA
Soheil Soleimani
Department of Mechanical and Materials Engineering, Florida International University, Miami, Florida 33174, USA
Yiding Cao
Department of Mechanical and Materials Engineering, Florida International University, Miami, Florida 33174

SINOPSIS

A bellows-type Reciprocating Mechanism-Driven Heat Loop (RMDHL) could attain a high heat transfer rate through reciprocating flow of the working fluid inside a heat transfer device while maintaining substantial temperature uniformity over its evaporator section. The objective of this paper is to numerically simulate a bellows-type RMDHL to predict its operational performance under different working conditions as well as a conventional dynamic pump-driven heat loop (DPDHL) as a benchmark for comparison. The numerical results are also compared with relevant experimental data with good agreement. The results indicate that the bellows-type RMDHL can meaningfully reduce the peak temperature of an electronic device and result in a significantly more uniform temperature across the electronic device. Considering the advantage of coolant leakage free for electronics-related applications, the single-phase bellows-type RMDHL could be an alternative to a conventional Liquid Cooling System (LCS) for electronic cooling applications.


Articles with similar content:

CFD Analysis of Desktop Heat Sink
Journal of Enhanced Heat Transfer, Vol.15, 2008, issue 3
T. K. K. Reddy, Panitapu Bhramara, K. Prashanth Reddy
ANALYSIS OF THE TWO-LAYERED MINI/MICRO-CHANNEL HEAT SINK BASED ON LIQUID METAL AND WATER
International Heat Transfer Conference 16, Vol.10, 2018, issue
Jing Liu, Yujie Ding, Sicong Tan
COMPARISON OF A TRADITIONAL HEAT SINK VERSUS A VAPOUR CHAMBER HEAT SINK COOLED BY FORCED CONVECTION
Second Thermal and Fluids Engineering Conference, Vol.18, 2017, issue
Nicolas Baudin, R. Kempers, Sajad Alimohammadi, Tim Persoons
PHASE CHANGE THERMAL TRANSPORT IN ETCHED SILICON MICROCHANNEL HEAT SINKS
International Heat Transfer Conference 13, Vol.0, 2006, issue
Sushil Bhavnani, D. Pate, Rory Jones
L-Shaped Thermosyphon Loop with Vertical Evaporator for Power Electronics Cooling
International Heat Transfer Conference 15, Vol.12, 2014, issue
Thomas B. Grandinger, Francesco Agostini