Journal of Enhanced Heat Transfer
Publicado 8 números por año
ISSN Imprimir: 1065-5131
ISSN En Línea: 1563-5074
IF:
2.3
5-Year IF:
1.8
Immediacy Index:
0.2
Eigenfactor:
0.00037
JCI:
0.6
SJR:
0.433
SNIP:
0.593
CiteScore™::
4.3
H-Index:
35
Indexed in
A Liquid Cooler Module with Carbon Foam for Electronics Cooling Applications
Volumen 15,
Edición 4, 2008,
pp. 313-324
DOI: 10.1615/JEnhHeatTransf.v15.i4.40
SINOPSIS
A liquid cooler module (LCM) employing high-thermal-conductivity, pitch-based carbon foam, which has effective conductivity of 150 W/m K and porosity of 90%, was studied. This study explores how this high-conductivity carbon foam could enhance liquid convection heat transfer due to the thermal dispersion effect. A three-dimensional numerical study of the carbon foam cooler was carried out. The numerical results indicate that with a heat flux of 100 W/cm2, the average temperature drop between the substrate and the liquid coolant remained below 20°C. Related experimental study was also conducted and the data were compared with the numerical results.
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