Publicado 8 números por año
ISSN Imprimir: 1065-5131
ISSN En Línea: 1563-5074
Indexed in
ENHANCEMENT OF FLOW-JET COMBINED BOILING HEAT TRANSFER OF FC-72 OVER MICRO-PIN-FINNED SURFACES
SINOPSIS
For highly efficient solving of the power dissipation problem of electronic components with high heat flux, experimental study of the flow-jet combined boiling heat transfer on silicon chips was conducted. Micro-pin-fins with dimensions of 30×60 µm2 and 30×120 µm2 (thickness × height) were fabricated on the chip surfaces by the dry etching technique. The experiments were made at three different cross-flow velocities Vc (0.5,1.0, 1.5 m/s) and different jet velocities Vj (0-2 m/s) with two liquid subcooling ΔTsub (25° C and 35° C). A smooth surface was also tested for comparison. The micro-pin-fins showed a considerable heat transfer enhancement due to an increase in effective heat transfer surface area caused by micro-convection around micro-pin-fins. The maximum allowable heat flux qmax is increased and the wall superheat is decreased greatly. For a given Vc, the heat transfer enhancement is more significant as Vj increases, but the qmax increment decreases as Vc increases. The fin efficiency decreases as Vc or/and Vj increases or the heat flux q increases. The maximum qmax can reach 161 W/cm2 at Vc = 1.5 m/s, Vj = 2 m/s, ΔTsub = 35°C for chip PF30-120.
-
Saha Sujoy Kumar, Ranjan Hrishiraj, Emani Madhu Sruthi, Bharti Anand Kumar, Flow Boiling Enhancement Techniques, in Two-Phase Heat Transfer Enhancement, 2020. Crossref
-
Guo Yuming , Luo Zhengyuan, Zhao Liang, ENHANCED FLOW BOILING OF OPEN MINI-CHANNEL AND JET IMPINGEMENT COOLING SCHEME BY SEPARATING LIQUID-VAPOR PATHWAYS , Journal of Enhanced Heat Transfer, 29, 5, 2022. Crossref