Suscripción a Biblioteca: Guest
Portal Digitalde Biblioteca Digital eLibros Revistas Referencias y Libros de Ponencias Colecciones
Journal of Enhanced Heat Transfer
Factor de Impacto: 0.562 Factor de Impacto de 5 años: 0.605 SJR: 0.175 SNIP: 0.361 CiteScore™: 0.33

ISSN Imprimir: 1065-5131
ISSN En Línea: 1026-5511

Volumes:
Volumen 27, 2020 Volumen 26, 2019 Volumen 25, 2018 Volumen 24, 2017 Volumen 23, 2016 Volumen 22, 2015 Volumen 21, 2014 Volumen 20, 2013 Volumen 19, 2012 Volumen 18, 2011 Volumen 17, 2010 Volumen 16, 2009 Volumen 15, 2008 Volumen 14, 2007 Volumen 13, 2006 Volumen 12, 2005 Volumen 11, 2004 Volumen 10, 2003 Volumen 9, 2002 Volumen 8, 2001 Volumen 7, 2000 Volumen 6, 1999 Volumen 5, 1998 Volumen 4, 1997 Volumen 3, 1996 Volumen 2, 1995 Volumen 1, 1994

Journal of Enhanced Heat Transfer

DOI: 10.1615/JEnhHeatTransf.2012003016
pages 331-341

COMPENSATION OF THREE-DIMENSIONAL HEAT CONDUCTION INSIDE WALL IN HEAT TRANSFER MEASUREMENT OF DIMPLED SURFACE BY USING TRANSIENT TECHNIQUE

Satomi Nishida
Department of Mechanical Systems Engineering, Tokyo University of Agriculture & Technology, Naka-cho 2-24-16, Koganei, Tokyo 184-8588, Japan
Akira Murata
Department of Mechanical Systems Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Nakacho, Koganei, Tokyo 184-8588, Japan
Hiroshi Saito
Mechanical Systems Engineering Course, Tokyo Metropolitan College of Industrial Technology, 1-10-40 Higashi-Ohi, Shinagawa, Tokyo 140-0011, Japan
Kaoru Iwamoto
Department of Mechanical Engineering, Tokyo University of Science, Noda-shi, Chiba 278-8510; Department of Mechanical System Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Nakacho, Koganei, Tokyo 184-8588, Japan

SINOPSIS

The transient technique using infrared thermography or liquid crystal has been widely used for measuring the distribution of local heat transfer coefficients. In this technique, wall surface temperature is measured, and the heat transfer coefficient is calculated so as to accord the measured temperature with the theoretical solution of a one-dimensional heat conduction problem. In actual cases of complicated surface geometry, however, three-dimensional heat conduction, caused by the three-dimensionality of the wall surface and the distribution of heat transfer coefficient, occurs in the wall. In this study, the heat transfer enhancement on the hemispherically dimpled surface was measured with an infrared camera, while the three-dimensional heat conduction in the wall was numerically calculated. In the compensation process, modification of the heat transfer coefficient was repeated until the numerical result agreed with the measured surface temperature. The present results showed that the heat transfer coefficient near the dimple edge was overrated, while that within the cavity was underrated. The maximum error induced by the three-dimensional heat conduction was +50% on the leading edge of the dimple, and the error in the other area was about −20% at most. At the dimple edge, the convex geometry increased the surface area where the heat flew into the wall, and consequently the temperature rise became larger than the flat part. On the other hand, within the dimple, the concave geometry formed the radially expanding heat conduction area, and the temperature became lower. The principal factor contributing to the error of the measurement is the three-dimensionality of the surface.