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Multiphase Science and Technology

Publicado 4 números por año

ISSN Imprimir: 0276-1459

ISSN En Línea: 1943-6181

SJR: 0.144 SNIP: 0.256 CiteScore™:: 1.1 H-Index: 24

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SATURATION AND SUBCOOLED CHF CORRELATIONS FOR PF-5060 DIELECTRIC LIQUID ON INCLINED ROUGH COPPER SURFACES

Volumen 26, Edición 2, 2014, pp. 139-170
DOI: 10.1615/MultScienTechn.v26.i2.20
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SINOPSIS

Pool-boiling experiments investigated the critical heat flux (CHF) for degassed PF-5060 dielectric liquid on inclined and uniformly heated 10×10 mm rough copper (Cu) surfaces. The experiments tested 13 surfaces with average roughness, Ra = 0.039 (smooth-polished), 0.134, 0.21, 0.28, 0.33, 0.58, 0.71, 0.80, 0.925, 1.00, 1.21, 1.44, and 1.79 μm, at inclination angles, θ = 0° (upward facing); 60°, 90° (vertical); and 120°, 150°, 160°, 170°, and 180° (downward facing). In addition, liquid subcooling in the experiments, ΔTsub, varied from 0 K (saturation) to 30 K. The CHF increased with increasing both surface roughness and liquid subcooling, but decreased with increasing inclination angle. For all inclinations, CHFsat on the roughest surface is ~35% higher than on the smoothpolished Cu. Moreover, regardless of Ra, CHFsat values in the downward facing orientation (180°) are typically ~31% of those in the upward facing orientation (0°). CHF in the upward facing orientation increases linearly with increasing liquid subcooling at a rate of ~2.2%/K, independent of Ra. This rate increases with increasing the inclination angle to as much as 4%/K in the downward facing orientation. The developed CHF correlation based on the present database accounts for surface roughness and inclination angle, and the liquid's subcooling and physical properties and agrees with the experimental data to within ±10%.

CITADO POR
  1. Suszko Arthur, El-Genk Mohamed S., Saturation boiling of PF-5060 on rough Cu surfaces: Bubbles transient growth, departure diameter and detachment frequency, International Journal of Heat and Mass Transfer, 91, 2015. Crossref

  2. Suszko Arthur, El-Genk Mohamed S., Thermally anisotropic composite heat spreaders for enhanced thermal management of high-performance microprocessors, International Journal of Thermal Sciences, 100, 2016. Crossref

  3. El-Genk Mohamed S., Suszko Arthur, Effects of inclination angle and liquid subcooling on nucleate boiling on dimpled copper surfaces, International Journal of Heat and Mass Transfer, 95, 2016. Crossref

  4. Jun Seongchul, Kim Jinsub, You Seung M., Kim Hwan Yeol, Effect of Subcooling on Pool Boiling of Water from Sintered Copper Microporous Coating at Different Orientations, Science and Technology of Nuclear Installations, 2018, 2018. Crossref

  5. El-Genk Mohamed S., Pourghasemi Mahyar, Experimental investigation of saturation boiling of HFE-7000 dielectric liquid on rough copper surfaces, Thermal Science and Engineering Progress, 15, 2020. Crossref

  6. Suszko Arthur, El-Genk Mohamed S., Bubbles Transient Growth in Saturation Boiling of PF-5060 Dielectric Liquid on Dimpled Cu Surfaces, Journal of Thermal Science and Engineering Applications, 8, 2, 2016. Crossref

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