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Abstract of "THERMAL MANAGEMENT OF HIGH-HEAT-FLUX DEVICES EDIFICE: EMBEDDED DROPLET IMPINGEMENT FOR INTEGRATED COOLING OF ELECTRONICS"

DOI: 10.1615/ICHMT.2000.TherSieProcVol2.100
74 pages

Cristina H. Amon
Office of the Dean, University of Toronto

Sinopsis

This presentation will first explore recent research developments for thermal management of high-heat-flux devices. These include detachable heat storage units, jet impingement, droplets and sprays, and phase-change cooling, heat pipes, capillary- and gravity-pumped loops. Micro-manufacturing and MEMS (Micro Electro-Mechanical Systems) will be discussed as enabling technologies for some innovative cooling schemes recently proposed.
In the second part of the presentation, the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics will be discussed. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes in the range 70-100 W/cm2, employing latent heat of vaporization of dielectric fluids (50-100 micron droplets) to achieve these high heat removal rates. A novel feature to enable adaptive on-demand cooling is MEMS sensing (on-chip temperature, remote IR temperature and ultrasonic dielectric film thickness) and MEMS actuation. EDIFICE will be integrated within the electronics package and fabricated using advanced micro-manufacturing technologies (e.g., deep RIE and CMOS CMU-MEMS). The development of EDIFICE involves modeling, CFD simulations, and physical experimentation on test beds. This presentation will then examine jet impingement cooling of EDIFICE with a dielectric coolant and the influence of several parameters such as impinging jet diameter, jet velocity, and latent heat effects.

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