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Heat Transfer Research
Facteur d'impact: 0.404 Facteur d'impact sur 5 ans: 0.8 SJR: 0.264 SNIP: 0.504 CiteScore™: 0.88

ISSN Imprimer: 1064-2285
ISSN En ligne: 2162-6561

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Heat Transfer Research

DOI: 10.1615/HeatTransRes.2017017180
pages 1299-1312

DESIGN OF A COOLING SYSTEM FOR MICROCHIPS WITH HIGH HEAT-FLUX DENSITY USING INTEGRATED MICROCHANNELS

Shufang Wang
College of Mechanical and Electrical Engineering, Beijing Union University, Beijing, 100020 China
Debao Zhou
Department of Mechanical and Industrial Engineering, University of Minnesota, Duluth, MN, 55812 USA
Zhiyong Yang
Astronautics Long March Rocket Technology Limited Company, Beij ing China, 100076

RÉSUMÉ

With the improvement of the integration technology, the heat-flux density in microchips has reached 1 kW/cm2. Traditional cooling methods cannot control the temperature below 393 K as desired. Thus chip cooling has become the bottleneck for further integration. To ensure a normal working condition, this paper proposed to use a microfluid to discharge the internal heat, by making the fluid flow through the integrated microchannels in a chip. To realize this, the present work firstly focused on the design of the microchannels based on a desired model of a microchip. Secondly, to find the optimized size of the microchannels, numerical simulation was performed. It was found that the diameter of the microchannels at 40 mm could keep the chip temperature around 393 K. Further experiments have been performed to verify the numerical results. Both the numerical and experimental results have shown that the highest temperature of a chip can be controlled to as low as 370 K through combining and adjusting the bidirectional flow, entering velocity, and entering temperature. These results proved the feasibility of the chip cooling concept using microchannels.