Abonnement à la biblothèque: Guest
Portail numérique Bibliothèque numérique eBooks Revues Références et comptes rendus Collections
Heat Pipe Science and Technology, An International Journal

ISSN Imprimer: 2151-7975
ISSN En ligne: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.2013006512
pages 187-201

EVAPORATION FROM MICROPOROUS SURFACES IN A MECHANICALLY PUMPED TWO-PHASE LOOP

Matthias Winter
Institute for Technical Thermodynamics, Center of Smart Interfaces, Technische Universitat Darmstadt, Petersenstrasse 17, 64287 Darmstadt, Germany
Peter Stephan
Institute for Technical Thermodynamics, Technische Universität Darmstadt, 64287 Darmstadt, Germany

RÉSUMÉ

The increasing application of high-power-density electronic components, for example, in space applications or data processing centers, causes the need of heat-transfer devices that can handle the high heat fluxes dissipated by these components. A prototype of a mechanically pumped two-phase loop has been developed at the Institute for Technical Thermodynamics in cooperation with OHB System AG and ESA/ESTEC. The loop incorporates miniature evaporators that can be mounted directly on the heat-dissipating device, minimizing temperature differences between the heat-dissipating part and the cooling device. Three evaporators are arranged in parallel to investigate the performance of the loop during multievaporator operation at different heat loads at the evaporators. In this study the heat-transfer coefficients of the new sintered surface could be increased up to 20 W/(cm2 K). The fouling of the surface slows down due to a higher porosity (bigger grain size, here 60 µm). The critical heat flux of the porous surfaces measured is limited to approx. 90 W/cm2 and does not increase with the volume flux (above 30 mL/min) as it happens with the smooth reference and a new microstructured surface. The microstructured surface reaches a critical heat flux of 152.6 W/cm2 and a heat-transfer coefficient of 6.5 W/(cm2 K) which is the best overall performance of all tested structures inside this evaporator type until now. System tests with three evaporators at different heat loads show stable system behavior. The saturation pressure inside the evaporators depends on the system heat load.

RÉFÉRENCES

  1. Kandlikar, S.G. , Fundamental issues related to flow boiling mini channels and microchannels.

  2. Kim, Y., Choi, C., Lee, K., and Han, D. , Experimental study of spray cooling performance on micro-porous coated surfaces.

  3. Schweizer, N., Stephan, P., and Schlitt, R. , A concept for a miniature, mechanically pumped two-phase cooling loop.

  4. Thome, J.R., Dupont, V., and Jacobi, A.M. , Heat transfer model for evaporation in microchannels, Part I. Presentation of the model.

  5. Winter, M., Schweizer, N., Stephan, P., and Schlitt, R. , Mechanically pumped two-phase loop for space application.


Articles with similar content:

INNOVATIVE THERMAL DESIGN SATELLITE WITH NETWORKED VARIABLE-CONDUCTANCE OSCILLATING HEAT PIPES
Heat Pipe Science and Technology, An International Journal, Vol.8, 2017, issue 1
Yoshiro Miyazaki, Naoko Iwata, Hiroyuki Ogawa, Hiroki Kawai, Seisuke Fukuda
A Novel Micro Cooling System for Electronic Devices Using a Micro Capillary Groove Evaporator
Journal of Enhanced Heat Transfer, Vol.11, 2004, issue 4
Xiaohong Yan, Y. H. Zhao, Xuegong Hu, Takaharu Tsuruta
SIMPLIFIED ANALYTICAL MODEL OF VERTICAL ARTERIAL HEAT PIPES
International Heat Transfer Conference 5, Vol.9, 1974, issue
V.G. Kiselyov, Leonard L. Vasiliev
LOOP HEAT PIPE FOR SPACECRAFT THERMAL CONTROL: THERMO VACUUM PERFORMANCE TEST RESULTS
Proceedings of the 24th National and 2nd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2017), Vol.0, 2017, issue
Amrit Ambirajan, Jaikumar V, Jasvanth V S, Abhijit A. Adoni, Srikanth T
HYBRID WICK VAPOR CHAMBER THERMAL PERFORMANCE EVALUATION FOR HIGH HEAT FLUX APPLICATION BY AIR COOLING
International Heat Transfer Conference 16, Vol.10, 2018, issue
Yanghe Liu, Feng Zhou, Tianzhu Fan, Ercan M. Dede