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Heat Pipe Science and Technology, An International Journal

ISSN Imprimer: 2151-7975
ISSN En ligne: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.2011002685
pages 205-217

STUDY ON THE PERFORMANCE OF AN ADVANCED WATER-COOLED HEAT SINK USING A THERMOSYPHON MECHANISM FOR ELECTRONIC DEVICES

Fumito Kaminaga
Graduate School of Science and Engineering, Ibaraki University, JAPAN
Kunihito Matsumura
Department of Mechanical Engineering, Ibaraki University, 4-12-1 Nakanaru-sawa, Hitachi 316-8511, Japan

RÉSUMÉ

A new type of water-cooled heat sink has been developed to maintain a low system pressure below atmosphere and obtain a high heat transfer rate by a combined structure with a thermosyphon containing a water working fluid and a water circulated jacket for cooling normal electronic devices operated far below 100°C. The purpose of the present study is to present fundamental heat transfer performance of the heat sink on different conditions of coolant temperature and flow rate and a charge rate of the working fluid. The experiments show the following findings: The heat sink can release heat transfer rates up to 160, 100, and 60 W for the coolant temperatures 20, 35, and 50°C, respectively, when the maximum allowable surface temperature of a simulated heat souce is assumed to be 70°C. The large heat transfer rate shown in 20°C is due to enhancement of boiling heat transfer caused by convective cooling by the jacket closely adjacent to the evaporator section. The thermal resistance of the heat sink is not affected by coolant temperature and charge rate and its value ranges from 0.1 to 0.15 K/W, which is slightly dependent on the heat transfer rate. The coolant flow rate affects the thermal resistance due to its large effect on the saturation temperature in the thermosyphon.


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