Publication de 8 numéros par an
ISSN Imprimer: 1065-5131
ISSN En ligne: 1563-5074
Indexed in
Enhanced Heat Transfer in Tight Space - A Frontier for Thermal Management of Microelectronic Equipment
RÉSUMÉ
Microelectronic equipment at extreme ends of the product spectrum-supercomputers on high end and portable computers on low end-are facing a common challenge in heat transfer engineering, namely, removal of increasingly large amounts of heat from constrained space. This paper reviews the cooling technologies focusing on their efficiency in space-constrained heat transfer. Also, some practical issues involved in the design of microchannel cooling systems are discussed.
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Nakayama Wataru , Bergles Arthur E. , Thermal Interfacing Techniques for Electronic Equipment—A Perspective , Journal of Electronic Packaging, 125, 2, 2003. Crossref
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Goldstein R.J., Eckert E.R.G., Ibele W.E., Patankar S.V., Simon T.W., Kuehn T.H., Strykowski P.J., Tamma K.K., Bar-Cohen A., Heberlein J.V.R., Davidson J.H., Bischof J., Kulacki F.A., Kortshagen U., Garrick S., Heat transfer – a review of 1999 literature, International Journal of Heat and Mass Transfer, 44, 19, 2001. Crossref
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Nakayama W., Behnia M., Soodphakdee D., A novel approach to the design of complex heat transfer systems: heat spreader and portable computer design-case studies, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069), 2000. Crossref