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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

Publication de 4  numéros par an

ISSN Imprimer: 1093-3611

ISSN En ligne: 1940-4360

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 0.4 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 0.1 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00005 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.07 SJR: 0.198 SNIP: 0.48 CiteScore™:: 1.1 H-Index: 20

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HIGH-RATE SILICON NITRIDE DEPOSITION FOR PHOTOVOLTAICS: FROM FUNDAMENTALS TO INDUSTRIAL APPLICATION

Volume 9, Numéro 1, 2005, pp. 141-157
DOI: 10.1615/HighTempMatProc.v9.i1.120
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RÉSUMÉ

The development of a novel plasma technique for high rate (> 1 nm/s) silicon nitride deposition for multifunctional antireflection coatings on crystalline silicon solar cells is described. The research has involved the analysis of the structural and optical properties of the silicon nitride films as obtained under different operating conditions using the N2-SiH4 and NH3-SiH4 reactant mixture. Furthermore, the fundamental plasma processes and the film growth mechanism have been studied in terms of plasma chemistry, plasma species, and their contribution to film growth. The feasibility of the application of the high-rate deposited silicon nitride as a bulk passivating antireflection coating has been proven by lab-scale experiments on multicrystalline silicon solar cells and the successful transfer of the technique into an industrial inline deposition system for high-volume production of solar cells is reported.

CITÉ PAR
  1. Oever P J van den, Hemmen J L van, Helden J H van, Schram D C, Engeln R, Sanden M C M van de, Kessels W M M, Downstream ion and radical densities in an Ar–NH3plasma generated by the expanding thermal plasma technique, Plasma Sources Science and Technology, 15, 3, 2006. Crossref

  2. Romero M F, Sanz M M, Tanarro I, Jiménez A, Muñoz E, Plasma diagnostics and device properties of AlGaN/GaN HEMT passivated with SiN deposited by plasma-enhanced chemical vapour deposition, Journal of Physics D: Applied Physics, 43, 49, 2010. Crossref

  3. Xiao S.Q., Xu S., Gu X.F., Song D.Y., Zhou H.P., Ostrikov K., Chemically active plasmas for surface passivation of Si photovoltaics, Catalysis Today, 252, 2015. Crossref

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