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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
SJR: 0.137 SNIP: 0.341 CiteScore™: 0.43

ISSN Imprimer: 1093-3611
ISSN En ligne: 1940-4360

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.v2.i3.90
pages 401-418

HETEROGENEITY OF TEXTURES AND STRESSES IN A LARGE TUNGSTEN PVD FILM

A. Garot-Piant
LM3-MET X - URA CNRS 1219 - ENSAM Paris 151 Bid de l'Hopital - 75013 PARIS France
A. Le Cornec
C.R.E.A./ S.M.S. - 16 bis, Ave Prieur de la Cote d'Or - 94114 ARCUEIL France
J.L. Lebrun
LM3 - CNRS URA 1219 - ENSAM 151, boulevard de l'Hopital 75013 Paris-France
C. Paturaud
C.R.E.A./ S.M.S. - 16 bis, Ave Prieur de la Cote d'Or - 94114 ARCUEIL France

RÉSUMÉ

This study deals with texture and stresses evaluations on tungsten coating on a large steel plate (150*240 mm2), as a function of its position with the magnetron target.
The films obtained by Physical Vapour Deposition process often reveal a fiber texture, implying a residual stress determination impossible by the usual X-rays diffraction method. The beam curvature technique is also difficult to apply in the case of thick substrates, justifying our interest of the x-rays diffraction methods. The stress determination method is then the Ideal Directions Method.
· About the heterogeneity all over the film, at the coating surface, an almost perfect <111> fiber texture with slight reinforcements and a very high compressive (around -3000 MPa) and almost isotropic stress level are observed. The fiber texture presents a progressive W inclination in connection with the columnar morphology, according to the short and long target axis; this inclination is in relation with ion incidence direction. About stresses, they are rather homogeneous all over the surface with a small decrease.
· About the heterogeneity within the thickness, the <111> fiber texture transforms towards a (110) <110> texture toward the interface and a slight stress gradient is observed.