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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
ESCI SJR: 0.176 SNIP: 0.48 CiteScore™: 1.3

ISSN Imprimer: 1093-3611
ISSN En ligne: 1940-4360

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.v11.i3.30
pages 345-358

CHEMICAL REACTIONS IN HEAT AND MASS TRANSFER BETWEEN SMALL PARTICLES AND PLASMA

Jacques Amouroux
Laboratoire de Genie des Precedes Plasmas Universite P. et M. Curie, ENSCP 11 rue P. et M. Curie 75005 Paris France
Sergey V. Dresvin
Laboratory of Electrotechnological and Plasma Installation of Polytechnic Institute -SPb State Polytechnical University, 29 Polytechnicheskaya Str., 195251 Saint-Petersburg, Russia
D. Ivanov
St. Petersburg State Polytechnic University, 29 Politekhnicheskaya Str., St. Petersburg, 195251, Russia

RÉSUMÉ

Our goal is to qualify the chemical reaction mechanisms which take place during the interaction between a RF air plasma and silicon particles.
The energy and mass transfer in the usual model take into account heat transfer from plasma by conduction and convection on the surface of the particle, radiation effect, melting, heating of vapor cloud and vaporization. So that heat and mass balance give us the possibility of modeling these processes. However exothermic reactions are able to appear between oxygen atoms and silicon which give SiO gas and strong enthalpy effect.
These mechanisms of chemical reactions between the air plasma and the silicon particles depend mainly of the plasma temperature and of the gas flow velocity. We propose to discuss the main results of this model in order to take into account the chemical mechanisms which appear on the surface plasma−powder.


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