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Interfacial Phenomena and Heat Transfer
ESCI SJR: 0.258 SNIP: 0.574 CiteScore™: 0.8

ISSN Imprimer: 2169-2785
ISSN En ligne: 2167-857X

Interfacial Phenomena and Heat Transfer

DOI: 10.1615/InterfacPhenomHeatTransfer.2020033426
pages 11-24


Wei Xiong
MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Ping Cheng
Mechanical Engineering Department, The Hong Kong University of Science and Technology; MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China; Qian Xuesen Laboratory of Space Technology, China Academy of Space Technology, Beijing 100094, China
Zhiyuan Ma
MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Xiaojun Quan
MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering Shanghai Jiao Tong University, 800 Dong Chuan Rd. Minhang District, Shanghai 200240, China
Wei Yao
Energy Conversion Research Center (ECRC), Qian Xuesen Laboratory of Space Technology, China Academy of Space Technology, P. O. Box: 5142-225, Beijing 100094, China


An experimental investigation is carried out to study the dynamics of a water droplet after its impact on two types of hydrophilic Cu powder beds (with the contact angle of 64° ± 10°), composed of uniform and non-uniform size particles, respectively. It is found that a droplet can infiltrate into a hydrophilic Cu powder bed composed of non-uniform size particles, and its penetration time is independent of the Weber (We) number. A droplet cannot infiltrate into a hydrophilic Cu powder bed composed of uniform size particles. Instead, the droplet bounces from the powder bed of uniform size particles (owing to the non-stick particle-coated surface) and forms a liquid marble. Maximum spread factors εmax on Cu powder beds are found to be smaller than that on a Cu substrate. Based on experimental data, the maximum spread factor on uniform and non-uniform hydrophilic powder beds can be scaled as εmax ~ We1/10 for 1 < We < 10 and as εmax ~ We1/5 for 10 < We < 40, respectively. It is also found that a hydrophilic powder bed, composed of small uniform size Cu particles (with an average diameter of 2.3 μm), behaves almost like a "super−hydrophobic" substrate, where the droplet can jump repeatedly after its impact on the powder bed. The droplet contact time after impacting on this powder bed is equal to the first-order oscillation period of the droplet.


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