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Page d'accueil ICHMT DL Année en cours Archives Comité de direction Centre international pour le transfert de chaleur et de masse


DOI: 10.1615/ICHMT.2015.IntSympAdvComputHeatTransf.280
pages 348-351

Benjamin Sponagle
Dept. of Mechanical Engineering, Dalhousie University, Halifax, Nova Scotia, Canada

Dominic Groulx
Mechanical Engineering, Dalhousie University, Halifax, Nova Scotia, Canada, B3H 4R2


A numerical model representative of a modern tablet computer was developed and used to analyze the use of integrated latent heat thermal storage. Thermal storage using phase change materials (PCMs) with melting temperatures of: 31.8°C, 43.3°C and 55.8°C were simulated. The effect of the thermal storage unit on the transient temperature profile of the system on a chip (SOC) and the back cover were analyzed. It was found that the SOC temperature can be significantly reduced by the integration of the latent heat thermal storage while still having a smaller but positive effect on the temperature of the back cover. The thermal storage with a melting temperature of 31.8°C was superior to the higher melting temperatures tested, it stored more heat and produced overall lower temperatures in the tablet computer.

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