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Heat Pipe Science and Technology, An International Journal

ISSN Print: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.v5.i1-4.690
pages 597-602

ULTRA-THIN HIGH PERFORMANCE HEAT PIPE FOR THIN AND LIGHT PORTABLE COMPUTING DEVICES

Masataka Mochizuki
Thermal Technology Division, Fujikura Ltd. 1-5-1, Kiba, Koto-Ku, Tokyo 135, Japan
T. Nguyen
Fujikura Ltd, 1-5-1, Kiba, Koto-Ku, Tokyo 135-8512, Japan
Koichi Mashiko
Fujkura, Limited, 1-5-1, Kiba, Koto-Ku, Tokyo 135-8512, Japan
Yuji Saito
Thermal Technology Division, Engineering Department, Fujikura Ltd. 1-5-1, Kiba, Koto-Ku, Tokyo 135, Japan
S. Ahamed
Fujikura Ltd, 1-5-1, Kiba, Koto-Ku, Tokyo 135-8512, Japan
R. Singh
Fujikura Ltd, 1-5-1, Kiba, Koto-Ku, Tokyo 135-8512, Japan
L. Phan
Fujikura Ltd, 1-5-1, Kiba, Koto-Ku, Tokyo 135-8512, Japan

ABSTRACT

Advance in computing technology towards miniature architecture has created a significant challenge task for cooling of the high-powered electronic components in a limited space available. Particularly, with the increasing trend of consumer use of portable smart devices like phones, tablets and thin and light computer so called ultrabook − all these devices has very limited space for cooling. Traditional heat pipe maybe not applicable due to large size, therefore, it is essential to develop new heat pipe which must be not only thinner, but also higher in thermal performance. This paper shows a detail development of ultra-thin heat pipes, as thin as 1mm or less. In order to improve and characterize the heat pipe thermal performance, various parameters were investigated such as wick structures, shapes, sizes and positioning; heat pipe shape, length and thickness; operating temperatures; water-surface wettability and operation against gravity. Maximum heat transfer and thermal resistance for various heat pipe shapes and sizes are presented for thin heat pipe thickness ranging from 0.8 to 2mm and heat transfer capability ranging from 5 to 50W. Discussion on the design and thermal performance and application of these thin heat pipes in thin and light portable computing devices such as smartphone, tablets and ultrabook.


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