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Heat Pipe Science and Technology, An International Journal

ISSN Print: 2151-7975
ISSN Online: 2151-7991

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.2013008155
pages 133-155

FEASIBILITY STUDY FOR MEASURING VAPOR CHAMBER THERMAL DIFFUSIVITY BASED ON THE ANGSTROM METHOD

Chen-I Chao
Engineering and System Science, National Tsing Hua University, Hsinchu City, Taiwan
Wei-Keng Lin
Engineering & System Science Department, National Tsing-Hua University 101, Sec. 2, Kuang Fu Rd., Hsinchu, Taiwan
Pei-Yu Yu
Department of Engineering and System Science, National Tsing Hua University 101, Sec. 2, Kuang Fu Road, Hsinchu, 300, Taiwan, Republic of China
Han-Chou Yao
Engineering and System Science, National Tsing Hua University, Hsinchu City, Taiwan

ABSTRACT

In this experiment, we applied the Angstrom method in measuring thermal diffusivity. In addition, we also measured the specific heat of thermal conducting material by using a specific heat measurement platform. The spreading thermal conductivity Ksp of thermal conducting material can be calculated from theoretical formula. We used copper and aluminum, two materials as the standards for calibrating thermal diffusivity measurement platform and specific heat measurement platform. The results show that the error was within 10%. We further applied these experimental calibration conditions in the measurement of thermal diffusivity of vapor chambers. The experimental results show that when the measurement distance between two points was 0.03 m, the error for copper thermal diffusivity was only 1.7% compared to the standard value, while the error for aluminum thermal diffusivity was only 4.79% compared to the standard value. The spreading thermal conductivity Ksp values for the copper-based vapor chamber and aluminum-based vapor chamber were 1390 W/m · K and 608 W/m · K, respectively. Both values were higher than the spreading thermal conductivity values of pure copper or aluminum.