Published 4 issues per year
ISSN Print: 2151-7975
ISSN Online: 2151-7991
DEVELOPMENT OF ADVANCED MINIATURE COPPER HEAT PIPES FOR A COOLING SYSTEM OF A MOBILE PC PLATFORM
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ABSTRACT
At present, miniature heat pipes are widely used for cooling systems of mobile PCs. This paper presents an overview of the development of miniature heat pipes (MHP) with a sintered copper wick with emphasis to different ways of heat pipe wick optimization. Several designs of cylindrical heat pipes with 4-, 5-, and 6-mm outer diameter and 200-mm length, which are the most attractive for the CPU cooling system, have been tailored, tested, and compared to theoretical values in this study to evaluate its thermal performances. A new design of 4- and 5-mm-outer diameter miniature copper heat pipes with innovative wicks is suggested as a promising candidate for present and future cooling systems of high-power mobile PC platforms.
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