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Journal of Enhanced Heat Transfer
IF: 0.562 5-Year IF: 0.605 SJR: 0.175 SNIP: 0.361 CiteScore™: 0.33

ISSN Print: 1065-5131
ISSN Online: 1026-5511

Journal of Enhanced Heat Transfer

DOI: 10.1615/JEnhHeatTransf.2017018821
pages 91-107

SUBCOOLED FLOW BOILING ON A TWO-STEP ELECTRODEPOSITED COPPER POROUS SURFACE

Wenbin Cui
Marine Engineering College, Dalian Maritime University, 1# Linghai Road, Dalian 116026, China
Solomon Kinuthia Mungai
College of Marine Engineering, Dalian Maritime University, Dalian, Liaoning, 116026, China
Corey Wilson
College of Marine Engineering, Dalian Maritime University, Dalian, Liaoning, 116026, China
Hongbin Ma
Marine Engineering College, Dalian Maritime University, Dalian, Liaoning 116026 China; Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, Missouri, 65211, USA
Bin Li
College of Marine Engineering, Dalian Maritime University, Dalian, Liaoning, 116026, China

ABSTRACT

A two-step electrodeposition method was applied to fabricate a microporous surface with an electrolyte solution of 1 M CuSO4, 0.5 M H2SO4, and 25 mM HCl. Four copper surfaces were first electrodeposited with a current density from 0.55 to 1.25 A/cm2, and the time for each was 15 s. In the second step, the current density was kept at a concentration of 50 mA/cm2 for 4800 s. The surface structure changed from a cauliflower-like structure to a honeycomb-like structure. In this case, the cauliflower-like-structured surfaces were hydrophobic, which was in great contrast to the results of a previously published similar experiment, in which the surfaces were superhydrophilic after twostep electrodeposition with a different current density and different electrodeposition durations. The surfaces in this study were tested under subcooled flow boiling conditions, and the results showed that these surfaces outperformed plain copper surfaces tested under nucleate boiling conditions. By comparison, the microporous surface electrodeposited with 1 A/cm2 under subcooled flow boiling performed the best, with a critical heat flux (CHF) of 174.0 W/cm2. The plain copper surface at the same temperature had a maximum heat flux of 138.6 W/cm2. Furthermore, it was found that the enhancement was hindered by a higher flow rate and higher subcoolings of the working fluid, and CHFs were affected by the surface wettability.


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