Published 8 issues per year
ISSN Print: 1065-5131
ISSN Online: 1563-5074
Indexed in
SUBCOOLED FLOW BOILING ON A TWO-STEP ELECTRODEPOSITED COPPER POROUS SURFACE
ABSTRACT
A two-step electrodeposition method was applied to fabricate a microporous surface with an electrolyte solution of 1 M CuSO4, 0.5 M H2SO4, and 25 mM HCl. Four copper surfaces were first electrodeposited with a current density from 0.55 to 1.25 A/cm2, and the time for each was 15 s. In the second step, the current density was kept at a concentration of 50 mA/cm2 for 4800 s. The surface structure changed from a cauliflower-like structure to a honeycomb-like structure. In this case, the cauliflower-like-structured surfaces were hydrophobic, which was in great contrast to the results of a previously published similar experiment, in which the surfaces were superhydrophilic after twostep electrodeposition with a different current density and different electrodeposition durations. The surfaces in this study were tested under subcooled flow boiling conditions, and the results showed that these surfaces outperformed plain copper surfaces tested under nucleate boiling conditions. By comparison, the microporous surface electrodeposited with 1 A/cm2 under subcooled flow boiling performed the best, with a critical heat flux (CHF) of 174.0 W/cm2. The plain copper surface at the same temperature had a maximum heat flux of 138.6 W/cm2. Furthermore, it was found that the enhancement was hindered by a higher flow rate and higher subcoolings of the working fluid, and CHFs were affected by the surface wettability.
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