Library Subscription: Guest
Begell Digital Portal Begell Digital Library eBooks Journals References & Proceedings Research Collections
Journal of Enhanced Heat Transfer
IF: 0.562 5-Year IF: 0.605 SJR: 0.175 SNIP: 0.361 CiteScore™: 0.33

ISSN Print: 1065-5131
ISSN Online: 1026-5511

Journal of Enhanced Heat Transfer

DOI: 10.1615/JEnhHeatTransf.v16.i3.20
pages 225-236

Heat Transfer and Pressure Drop Characteristics in Dielectric Flow in Surface-Augmented Microchannels

Rory J. Jones
Goodman Manufacturing Company
Daniel T. Pate
Applied Technical Services, 1049 Triad Court, Marietta, GA 30062
Naveenan Thiagarajan
Department of Mechanical Engineering, Auburn University, AL 36849; GE Global Research, Niskayuna, New York 12309, USA
Sushil Bhavnani
Department of Mechanical Engineering, Auburn University, Auburn, Alabama 36849, USA


Microchannel heat sinks incorporating phase-change can be an effective remedy to problems encountered with extreme heat fluxes in modern day micro processor chips. An augmented surface has been created that consists of 20-micron re-entrant cavities etched in the base of each channel in the microchannel array. These cavities significantly impact the flow regime by promoting stable nucleate boiling. The phase-change thermal transport reported here is carried out on microchannel heat sinks etched in silicon and cooled by the dielectric fluid FC72. Heat transfer coefficients and pressure drops reported were measured using a versatile continuous flow loop that permitted experiments at a variety of inlet subcooling values and pressures. The results show stable thermal performance with low pressure drops that were correctly represented by the homogeneous two-phase model. The highest pressure drop measured was 17.5 kPa at a mass flux of 2138 kg/m2·s and at an inlet subcooling of 5°C.