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Journal of Enhanced Heat Transfer
IF: 0.562 5-Year IF: 0.605 SJR: 0.211 SNIP: 0.361 CiteScore™: 0.33

ISSN Print: 1065-5131
ISSN Online: 1026-5511

Journal of Enhanced Heat Transfer

DOI: 10.1615/JEnhHeatTransf.2012005999
pages 489-503

ENHANCEMENT OF FLOW-JET COMBINED BOILING HEAT TRANSFER OF FC-72 OVER MICRO-PIN-FINNED SURFACES

Yonghai Zhang
State Key Laboratory of Multiphase Flow in Power Engineering, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, P.R. China; School of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an 710049, China
Jinjia Wei
School of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, P.R. China; Key Laboratory of Multiphase Flow in Power Engineering, Xi'an Jiaotong Uniersity, Xi'an, 710049, P.R.China
Dong Guo
YanTai WanHua Group, YanTai, 264000, China

ABSTRACT

For highly efficient solving of the power dissipation problem of electronic components with high heat flux, experimental study of the flow-jet combined boiling heat transfer on silicon chips was conducted. Micro-pin-fins with dimensions of 30×60 µm2 and 30×120 µm2 (thickness × height) were fabricated on the chip surfaces by the dry etching technique. The experiments were made at three different cross-flow velocities Vc (0.5,1.0, 1.5 m/s) and different jet velocities Vj (0-2 m/s) with two liquid subcooling ΔTsub (25° C and 35° C). A smooth surface was also tested for comparison. The micro-pin-fins showed a considerable heat transfer enhancement due to an increase in effective heat transfer surface area caused by micro-convection around micro-pin-fins. The maximum allowable heat flux qmax is increased and the wall superheat is decreased greatly. For a given Vc, the heat transfer enhancement is more significant as Vj increases, but the qmax increment decreases as Vc increases. The fin efficiency decreases as Vc or/and Vj increases or the heat flux q increases. The maximum qmax can reach 161 W/cm2 at Vc = 1.5 m/s, Vj = 2 m/s, ΔTsub = 35°C for chip PF30-120.


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