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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

Published 4 issues per year

ISSN Print: 1093-3611

ISSN Online: 1940-4360

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 0.4 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 0.1 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00005 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.07 SJR: 0.198 SNIP: 0.48 CiteScore™:: 1.1 H-Index: 20

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RELEVANT PARAMETERS FOR LASER BONDING OF COPPER ON ALUMINA

Volume 10, Issue 2, 2006, pp. 281-300
DOI: 10.1615/HighTempMatProc.v10.i2.100
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ABSTRACT

A laser process was used to produce copper tracks on alumina substrates. The numerous operating parameters involved made it difficult. In order to determinate the most influent factors among laser power (from 10 to 100 W), laser beam diameter (from 1 to 5 mm), preheating temperature of the substrate (from 200 to 400°C), scanning velocity (from 1 to 100 mrn·s−1), scanning overlap (from 0 to 90%) and copper grain size (three different powders), a Plackett and Burman's design of experiments has been used. With a very limited number of experiments (8), this method allowed to obtain first encouraging results. Indeed adherent copper tracks with an electrical conductivity of 6·104 S·m−1 were obtained.

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