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International Journal for Multiscale Computational Engineering
IF: 1.016 5-Year IF: 1.194 SJR: 0.554 SNIP: 0.82 CiteScore™: 2

ISSN Print: 1543-1649
ISSN Online: 1940-4352

International Journal for Multiscale Computational Engineering

DOI: 10.1615/IntJMultCompEng.2020035631
pages 455-476


Wei Hu
Computational and Multiscale Mechanics Group, Livermore Software Technology, An Ansys Company, Livermore, CA, USA
Xiaofei Pan
Computational and Multiscale Mechanics Group, Livermore Software Technology, An Ansys Company, Livermore, CA, USA
Dandan Lyu
Computational and Multiscale Mechanics Group, Livermore Software Technology, An Ansys Company, Livermore, CA, USA
Ashutosh Srivastava
Ansys Inc., Canonsburg, PA, USA
Siddharth Shah
Ansys Inc., Canonsburg, PA, USA
Cheng-Tang Wu
Computational and Multiscale Mechanics Group, Livermore Software Technology, An Ansys Company, Livermore, CA, USA


In this paper, we introduce a new computational approach for linking the information of mesoscale solder ball shapes to the macroscale drop test of a printed circuit board. The approach starts with a numerical prediction of mesoscale solder bump profiles using a novel full-implicit Lagrangian particle method to approximate the Navier-Stokes equations and efficiently simulate the incompressible free surface reflow soldering process. The surface tension of the molten solder and the wall adhesion between the solder and the substrate are considered in the simulation. Subsequently, the predicted solder ball shapes from the reflow analysis are used in a chip package model for the drop shock analysis. The mesoscale solder joint model is coupled concurrently with the macroscale chip package model using the co-simulation to achieve the nonintrusive scale-bridging effect. To attend practical explicit-explicit two-scale co-simulations, an algorithm that handles properly the load-balancing, heterogeneity of processors, and memory also has been developed. We present four numerical examples that showcase the effectiveness of the new approach.


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