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Computational Thermal Sciences: An International Journal

ISSN Print: 1940-2503
ISSN Online: 1940-2554

Computational Thermal Sciences: An International Journal

DOI: 10.1615/ComputThermalScien.2017018486
pages 297-310

NUMERICAL SIMULATION OF MELTING AND SOLIDIFICATION OF DIFFERENT KINDS OF PHASE CHANGE MATERIALS (PCM) ENCAPSULATED IN SPHERICAL NODULES IN A WATER FLOW

Khouiled Rachedi
ETAP Laboratory, Department of Mechanical Engineering, University of Tlemcen, B.P. 230, Tlemcen 13000, Algérie
Abdel Illah Nabil Korti
ETAP Laboratory, Department of Mechanical Engineering, University of Tlemcen, B.P. 230, Tlemcen 13000, Algérie

ABSTRACT

The objective of this work is to carry out a computational study on the thermal behavior of two different phase change materials (PCMs), inside aluminum spherical capsules, in both charging and discharging modes. Water is used as heat transfer fluid (HTF) at constant temperature. The thermal and dynamical behavior of both PCM, i.e., PCM1 and PCM2, put in two capsules, is detailed at the beginning of this study. The results indicate that natural convection dominates heat transfer during the chargingmode. The solidification phase is conduction-dominated in the discharging mode. Moreover, these same results suggest that the PCM1-PCM1 configuration is preferable when the application requires the storage of a small latent energy (latent heat) and a long discharge time. Whereas configuration PCM2-PCM2 is preferred when the application requires the storage of a large latent heat energy and a short discharge time. However, the configuration PCM1-PCM2 is more desirable when the application requires the storage of an average latent heat energy with a long discharge time. Moreover, for the height velocity of water flow, the latent heat energy packed by two different PCM without thermal interaction is the arithmetical addition between them. Whereas, from v = 10-5, the thermal interaction between two different PCM cannot be neglected and the energy stored is not the arithmetic addition. The thermal interaction appears clearly in the discharging mode. Thus, the thermal interaction has accelerated the discharging of PCM2. Whereas, the discharging of PCM1 is prolonged by this thermal interaction.