RT Journal Article
ID 13b8dc604722e5ed
A1 Zhang, Yonghai
A1 Wei, Jin-Jia
A1 Guo, Dong 
T1 ENHANCEMENT OF FLOW-JET COMBINED BOILING HEAT TRANSFER OF FC-72 OVER MICRO-PIN-FINNED SURFACES
JF Journal of Enhanced Heat Transfer
JO JEH(T)
YR 2012
FD 2012-12-06
VO 19
IS 6
SP 489
OP 503
K1 heat transfer enhancement
K1 micro-pin-fin
K1 flow boiling
K1 jet impingement
K1 FC-72
AB For highly efficient solving of the power dissipation problem of electronic components with high heat flux, experimental study of the flow-jet combined boiling heat transfer on silicon chips was conducted. Micro-pin-fins with dimensions of 30&#215;60 &#181;m<sup>2</sup> and 30&#215;120 &#181;m<sup>2</sup> (thickness &#215; height) were fabricated on the chip surfaces by the dry etching technique. The experiments were made at three different cross-flow velocities V<sub>c</sub> (0.5,1.0, 1.5 m/s) and different jet velocities V<sub>j</sub> (0-2 m/s) with two liquid subcooling &#916;T<sub>sub</sub> (25&#176; C and 35&#176; C). A smooth surface was also tested for comparison. The micro-pin-fins showed a considerable heat transfer enhancement due to an increase in effective heat transfer surface area caused by micro-convection around micro-pin-fins. The maximum allowable heat flux q<sub>max</sub> is increased and the wall superheat is decreased greatly. For a given V<sub>c</sub>, the heat transfer enhancement is more significant as V<sub>j</sub> increases, but the q<sub>max</sub> increment decreases as V<sub>c</sub> increases. The fin efficiency decreases as V<sub>c</sub> or/and V<sub>j</sub> increases or the heat flux q increases. The maximum q<sub>max</sub> can reach 161 W/cm<sup>2</sup>  at V<sub>c</sub> &#61; 1.5 m/s, V<sub>j</sub> &#61; 2 m/s, &#916;T<sub>sub</sub> &#61; 35&#176;C for chip PF30-120.
PB Begell House
LK https://www.dl.begellhouse.com/journals/4c8f5faa331b09ea,606abcbf1d8212d4,13b8dc604722e5ed.html