年間 18 号発行
ISSN 印刷: 1064-2285
ISSN オンライン: 2162-6561
IF:
1.7
5-Year IF:
1.4
Immediacy Index:
0.6
Eigenfactor:
0.00072
JCI:
0.43
SJR:
0.318
SNIP:
0.568
CiteScore™::
3.5
H-Index:
28
Indexed in
PARAMETRIC NUMERICAL STUDY OF THE FLOW AND HEAT TRANSFER IN A DIMPLED WAVY MICROCHANNEL
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要約
Thermal management of microchips and integrated circuits becomes a more and more serious problem, since the density of transistors grows. In this paper, a new microchannel cooling method, a microchannel heat sink with dimples, is investigated with respect to heat transfer and flow resistance for electronics thermal management. Five types of microchannel heat sink, viz. one smooth channel, one wavy channel, and three wavy channels with dimples, were studied by a numerical method. The sizes of a single module are all 1 mm × 1 mm × 20 mm; the equivalent diameters of the channel inlet are all 500 µm; the heat flux of 1 W/mm2 is set on the bottom of the all kinds of a heat sink. The simulation results show that dimples could break up a boundary layer and enhance heat convection, which improve the thermal performance of a microchannel heat sink.
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