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Heat Transfer Research
インパクトファクター: 0.404 5年インパクトファクター: 0.8 SJR: 0.264 SNIP: 0.504 CiteScore™: 0.88

ISSN 印刷: 1064-2285
ISSN オンライン: 2162-6561

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Heat Transfer Research

DOI: 10.1615/HeatTransRes.2015010726
pages 105-118

PARAMETRIC NUMERICAL STUDY OF THE FLOW AND HEAT TRANSFER IN A DIMPLED WAVY MICROCHANNEL

Liang Gong
Department of Energy and Power Engineering, China University of Petroleum (East China), 66 West Changjiang Rd. Huangdao District, Qingdao 266580, PR. China
Hui Lu
Department of Energy and Power Engineering, College of Pipeline and Civil Engineering, China University of Petroleum (East China), Chang Jiang Road, Qingdao, China 266580
Hongyan Li
Department of Energy and Power Engineering, College of Pipeline and Civil Engineering, China University of Petroleum (East China), Chang Jiang Road, Qingdao, China 266580
Minghai Xu
Department of Energy and Power Engineering, College of Pipeline and Civil Engineering, China University of Petroleum (East China), Chang Jiang Road, Qingdao, China 266580

要約

Thermal management of microchips and integrated circuits becomes a more and more serious problem, since the density of transistors grows. In this paper, a new microchannel cooling method, a microchannel heat sink with dimples, is investigated with respect to heat transfer and flow resistance for electronics thermal management. Five types of microchannel heat sink, viz. one smooth channel, one wavy channel, and three wavy channels with dimples, were studied by a numerical method. The sizes of a single module are all 1 mm × 1 mm × 20 mm; the equivalent diameters of the channel inlet are all 500 µm; the heat flux of 1 W/mm2 is set on the bottom of the all kinds of a heat sink. The simulation results show that dimples could break up a boundary layer and enhance heat convection, which improve the thermal performance of a microchannel heat sink.