ライブラリ登録: Guest
Begell Digital Portal Begellデジタルライブラリー 電子書籍 ジャーナル 参考文献と会報 リサーチ集
Heat Transfer Research
インパクトファクター: 0.404 5年インパクトファクター: 0.8 SJR: 0.264 SNIP: 0.504 CiteScore™: 0.88

ISSN 印刷: 1064-2285
ISSN オンライン: 2162-6561

巻:
巻 50, 2019 巻 49, 2018 巻 48, 2017 巻 47, 2016 巻 46, 2015 巻 45, 2014 巻 44, 2013 巻 43, 2012 巻 42, 2011 巻 41, 2010 巻 40, 2009 巻 39, 2008 巻 38, 2007 巻 37, 2006 巻 36, 2005 巻 35, 2004 巻 34, 2003 巻 33, 2002 巻 32, 2001 巻 31, 2000 巻 30, 1999 巻 29, 1998 巻 28, 1997

Heat Transfer Research

DOI: 10.1615/HeatTransRes.2016010297
pages 733-744

THERMAL CONTACT CONDUCTANCE AS A METHOD OF RECTIFICATION IN BULK MATERIALS

Robert A. Sayer
Engineering Sciences Center, Sandia National Laboratories, Albuquerque, NM, USA

要約

A thermal rectifier that utilizes thermal expansion to directionally control interfacial conductance between two contacting surfaces is presented. The device consists of two thermal reservoirs contacting a beam with one rough and one smooth end. When the temperature of reservoir in contact with the smooth surface is raised, a similar temperature rise will occur in the beam, causing it to expand, thus increasing the contact pressure at the rough interface and reducing the interfacial contact resistance. However, if the temperature of the reservoir in contact with the rough interface is raised, the large contact resistance will prevent a similar temperature rise in the beam. As a result, the contact pressure will be marginally affected and the contact resistance will not change appreciably. Owing to the decreased contact resistance of the first scenario compared to the second, thermal rectification occurs. A parametric analysis is used to determine optimal device parameters including surface roughness, contact pressure, and device length. Modeling predicts that rectification factors greater than 2 are possible at thermal biases as small as 3 K. Additionally, thin surface coatings are discussed as a method to control the temperature bias at which maximum rectification occurs.


Articles with similar content:

Evaporation of Water Drop on Photo-Induced Hydrophilic Surface
International Heat Transfer Conference 12, Vol.37, 2002, issue
Sumitomo Hidaka, Yasuyuki Takata, Masataka Masuda, Hiroshi Yamamoto, Takehiro Ito
MINIMUM FLOW-RATES AND REWETTING-RATES OF FALLING FILMS
International Heat Transfer Conference 7, Vol.11, 1982, issue
Jens J. Schroder, U. Pohl, A. Horsthemke
CONTACT ANGLE AND SURFACE TENSION MEASUREMENTS ON A METAL DROP BY IMAGE PROCESSING AND NUMERICAL CALCULATION
High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes, Vol.4, 2000, issue 3
J. C. Labbe, D. Tetard, M.E.R. Shanahan, V. Leroux, J.F. Goujaud
EXPERIMENTS ON THE EFFECTS OF SURFACE WETTABILITY AND INCLINATION ANGLE ON THE CONDENSER PERFORMANCE OF LOOP THERMOSYPHONS
International Heat Transfer Conference 16, Vol.13, 2018, issue
Shwin-Chung Wong, Ji-Yu Du
CHARACTERIZATION OF NANOSTRUCTURED THERMAL INTERFACE MATERIALS - A REVIEW
ICHMT DIGITAL LIBRARY ONLINE, Vol.0, 2011, issue
Zhuomin M. Zhang, Yogendra K. Joshi, Andrew J. McNamara