ライブラリ登録: Guest
Begell Digital Portal Begellデジタルライブラリー 電子書籍 ジャーナル 参考文献と会報 リサーチ集
Journal of Enhanced Heat Transfer
インパクトファクター: 0.562 5年インパクトファクター: 0.605 SJR: 0.175 SNIP: 0.361 CiteScore™: 0.33

ISSN 印刷: 1065-5131
ISSN オンライン: 1026-5511

Journal of Enhanced Heat Transfer

DOI: 10.1615/JEnhHeatTransf.2015014170
pages 267-280

COMPOSITE THERMAL ANNEALED PYROLYTIC GRAPHITE HEAT SPREADERS PRODUCED WITH FIELD-ASSISTED SINTERING TECHNOLOGY

Aaron Rape
Applied Research Laboratory, Pennsylvania State University, State College, Pennsylvania 16801, USA
Kevin Gott
Mechanical Engineering Department, Pennsylvania State University, State College, Pennsylvania 16801, USA
Jogender Singh
Applied Research Laboratory, Pennsylvania State University, State College, Pennsylvania 16801, USA
Anil K. Kulkarni
Mechanical Engineering Department, Pennsylvania State University, State College, Pennsylvania 16801, USA

要約

The fabrication, testing and modeling of thermal annealed pyrolytic graphite (TPG) encapsulated heat spreaders was explored for potential use in the cooling of microelectronic devices. The 60 mm diameter, 5 mm thick heat spreaders were created using field-assisted sintering technology (FAST). The TPG encapsulated heat spreaders were compared to their simple aluminum and copper versions through both experimental measurements and numerical calculations. The results show that TPG encapsulated heat spreaders yield lower and more uniform surface temperatures when exposed to identical heating conditions. Heat spreaders such as these should be considered for cooling the next generation of high power density microelectronic devices.