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International Journal of Fluid Mechanics Research
ESCI SJR: 0.206 SNIP: 0.446 CiteScore™: 0.5

ISSN 印刷: 2152-5102
ISSN オンライン: 2152-5110

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International Journal of Fluid Mechanics Research

DOI: 10.1615/InterJFluidMechRes.v29.i2.20
12 pages

Heat Transfer in a Thin Liquid Film in the Presence of Electric Field for Non-Isothermal Interfacial Condition

Rama Subba Reddy Gorla
Department of Mechanical Engineering, Cleveland State University, Cleveland, OH, 44115 USA; Department of Mechanical Engineering, University of Akron, Akron, Ohio 44325, USA; Department of Mechanical & Civil Engineering, Purdue University Northwest, Westville, IN 46391, USA
Jorge E. Gatica
Department of Chemical Engineering Cleveland State University Cleveland, OH 44115, USA
Bahman Ghorashi
Department of Chemical & Biomedical Engineering, Cleveland State University, Cleveland, Ohio 44115-2425
Pijarn In-Eure
Department of Chemical Engineering Cleveland State University Cleveland, OH 44115, USA
Larry W. Byrd
Thermal Structures Branch, Air Vehicles Directorate, Air Force Research Laboratory, Wright Patterson Air Force Base, OH 45433, USA

要約

Heat transfer enhancement in an evaporating thin liquid film using the electric field under non-isothermal interfacial condition is presented. A new mathematical model subjected to van der Waals attractive forces, the capillary pressure and the electric field is developed to describe the heat transfer enhancement in the evaporating thin liquid film. The effect of an electrostatic field on the curvature of the thin film, evaporative flux, pressure gradient distribution, heat flux, and heat transfer coefficient in the thin film is presented. The results show that the electric field can enhance heat transfer in the thin liquid film significantly. In addition, using electric fields on the evaporating film will be a way to expand the extended meniscus region to attain high heat transfer coefficients and high rates of heat flux.


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