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AN EXPERIMENTAL STUDY ON PERFORMANCE ENHANCEMENT OF CMOS COMPATIBLE MONOLITHIC MICROCHANNEL HEAT SINKS

DOI: 10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700
pages 941-952

Aziz Koyuncuoglu
Micro and Nanotechnology Program, Graduate School of Arts and Sciences, Middle East Technical University, Dumlupınar Blv. No 1, 06800, Ankara, Turkey; METU-MEMS Research and Application Center, Middle East Technical University, Dumlupınar Blv. No 1, 06800, Ankara, Turkey

Goker Turkakar
Dept. of Mechanical Engineering, Middle East Technical University, Dumlupinar Blv. No 1, 06800, Ankara, Turkey

Matthew Redmond
Dept. of Mechanical Engineering, Middle East Technical University, Dumlupinar Blv. No 1, 06800, Ankara, Turkey; George W. Woodruff School of Mechanical Engineering, 801 Ferst Drive, Georgia Institute of Technology, Atlanta, GA 30332-0405, USA

Tuba Okutucu-Ozyurt
Dept. of Mechanical Engineering, Micro and Nanotechnology Program, Graduate School of Arts and Sciences, Middle East Technical University, Dumlupinar Blv. No 1, 06800, Ankara, Turkey

Haluk Kulah
Micro and Nanotechnology Program, Graduate School of Arts and Sciences, Middle East Technical University, Dumlupınar Blv. No 1, 06800, Ankara, Turkey; METU-MEMS Research and Application Center, Middle East Technical University, Dumlupınar Blv. No 1, 06800, Ankara, Turkey; Dept. of Electrical and Electronics Engineering, Middle East Technical University, Dumlupınar Blv. No 1, 06800, Ankara, Turkey

Satish Kumar
George W. Woodruff School of Mechanical Engineering, 801 Ferst Drive, Georgia Institute of Technology, Atlanta, GA 30332-0405, USA

要約

A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 μm by 50 μm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

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