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Heat Transfer Research
Fator do impacto: 1.199 FI de cinco anos: 1.155 SJR: 0.267 SNIP: 0.503 CiteScore™: 1.4

ISSN Imprimir: 1064-2285
ISSN On-line: 2162-6561

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Heat Transfer Research

DOI: 10.1615/HeatTransRes.2018025129
pages 349-360

A NOVEL LIQUID-PACKAGING TECHNOLOGY FOR HIGHLY RELIABLE UV-LED ENCAPSULATION

Wen-Hua Zhang
Department of Engineering and System Science, National Tsing-Hua University, Hsinchu City, Taiwan
Wei-Keng Lin
Department of Engineering and System Science, National Tsing-Hua University, Hsinchu City, Taiwan
Chih-Ting Yeh
Department of Mechanical Engineering, National Chiao Tung University, Hsinchu City, Taiwan
Song-Bor Chiang
Green Energy and Environment Research Laboratories, Industrial Technology Research Institute, Hsinchu City, Taiwan
Chih-Sheng Jao
Green Energy and Environment Research Laboratories, Industrial Technology Research Institute, Hsinchu City, Taiwan

RESUMO

This paper proposes a liquid-packaging technology for UV LED. Unlike the traditional packaging methods that involve thermosett ing silicon or quartz glass, the proposed method primarily uses silicon oil to directly contact the chip, which prevents erosion due to moisture or oxygen. In this study, UV LEDs with high heat dissipation technology were selected, and the experimental results of optical and thermal management were compared between the general packaging and liquid-packaging structures, respectively. The results of the optical experiments showed that the proposed method increases the extraction effi ciency by 9.5%. The results of the heat dissipation experiments showed that the liquid-packaging technology can reduce the thermal resistance of the UV-LED package by 31%.


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